Samsung is working with an FE flip-style collapsible, we have actually been hearing that a lot in the past couple of months. It’s still open to question whether this will certainly be called Galaxy Z Flip FE or Galaxy Z Flip7 FE, however regardless of that (we’ll just call it the Flip FE), we now know the chipset inside.
That’s since a model has actually run Geekbench, and the standard’s online database has exposed what’s inside: Samsung’s Exynos 2400 SoC. Not the 2400e that was seen in the Galaxy S24 FE in 2015, mind you, yet the 2400 itself.
— Abhishek Yadav (@yabhishekhd) May 12, 2025
As you may know, this SoC was inside the Galaxy S24 and S24+ in some regions, which launched back in January of last year. While that’s rather a long time ago in the mobile globe, this was a flagship chipset at the time (individuals’s problems with the Exynos range apart), therefore it should be a respectable chip for the probably affordable Flip FE.
Obviously, the prices itself will make or damage this tool – at near $500-600, most individuals will probably not have a problem with the chipset choice, but if it’s $700-800 and even extra, then the discussion will most definitely change.
Anyhow, the chip was paired with 8GB of RAM in the prototype that ran the criteria, and the tool ran Android 16, that makes us believe it may introduce with One UI 8 on board. It also tells us that it’s not coming very soon – maybe introduced together with the Flip7 and Fold7 in very early July or afterwards, yet probably not faster, because Google is just planning to release Android 16 in June.
Now allow’s deal with the elephant in the space. Last week a leakage supposedly gave us the specs of the Flip FE, and it was said to be powered by the Snapdragon 8 Gen 3 SoC. Either that leak was wrong, or Samsung is intending on releasing the device with two different chips in different areas, which would not be shocking given just how much it’s done that for the flagship Galaxy S household in the past.
